Features

• Automated high-resolution 3D, X-Ray measurement technology
• Visualize the inner structure of PCBA to eliminate defects.
• Broaden the range of objects able to be inspected, from Semiconductor to Power module.
• High-resolution and highly stable open X-ray tube.
• Prolonged stability with the high-rigidity gantry structure.
• High safety, based on European standards.
• Identifying various defects using high-resolution CT data.
• Seamless 3D data improves inspection efficiency
• Utilize automated 3D image reconstruction to perform inspection and analysis at the same time.
• The BF-X2 can inspect electronic components, solder, voids in microscopic pores, Head-in-Pillow (HiP), non-whetting, and multi-layer solder inspection for power modules.
• Planar CT (PCT)has high resolution in both the horizontal and vertical directions. PCT produces high-resolution images for even the bottom side of the PCBA.
• The BF-Monitor Repair Terminal allows operators to verify defects in 3D images.
• BF2-Editor offline programming software allows the user to automatically create inspection parameter data, directly from the CAD data.